The AV-300 Automated Wire Bond Inspection System

The ALLTEQ AV-300 is a fully-automatic 3rd Optical wire bond inspection module designed to fit onto ALLTEQ's 3000 Series Inspection Stations or directly onto a customer's wire bonders.

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Standard Features:

  • Cost-effective process
  • User-Friendly, Flexible Software
  • Windows-Based User Interface
  • High Speed Defect Detection
  • 100% Device Inspection
  • Random or Fixed Sample Inspection with Programmable AQL
  • Customized Inspection
  • Ultra High Resolution Cameras and Optics
  • Custom Programmable LED Lighting
  • Yield, Defect, Machine, Product Type Data Collection Center (DCC)
  • Standard or Customer-defined Reporting
  • Expandable
  • Pass Fail Mode FASTEST UPH MODE
  • Measure, Code Read, Correlate, Data Collect Mode*

*UPH Dependant on Wire Count, Measurements, Inspection Criteria, etc.

Standard Inspection Capabilities:

  • Missing Die
  • Missing Wire
  • Misplaced Wire
  • Wire Shorts
  • Wire Breaks
  • Ball Measurement
  • Correct Wire Bond Location Verification
  • Wire Bond Mapping
  • Multi Die Verification / Missing Component on MCM's
  • Ink Dot
  • Wire Sag / Track
  • Die Attach Wetting
  • Epoxy Check - On Die or Lead
  • Chipped or Crack Die
  • Die Scratch
  • Die Orientation
  • Correct Die
  • Theta Check
  • Die Location
  • MeasurementSerial / Part Numbers / Bar Codes / Device Codes
  • Foreign Particles