Allteq Automated Wire Bond Inspection
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Model LFI-3060 Programmable XY After Wire Bond Inspection Station     CV700 Series
Automatic 3rd Optical Inspection (AV-300) 

The Allteq AV-300 is a fully automatic 3rd Optical wire bond inspection module designed to fit onto Allteqs 3000 Series Inspection Stations or directly onto a customers wire bonders.

 Standard Features:

  • Cost Effective Process
  • User Friendly, Self Teach, Flexible Software
  • Windows Based User Interface
  • High Speed Defect Detection
  • 100% Device Inspection
  • Random or Fixed Sample Inspection with Programmable AQL
  • Customized Inspection
  • Ultra High Resolution Cameras and Optics
  • Custom Programmable LED Lighting
  • Yield, Defect, Machine, Product Type Data Collection Center (DCC)
  • Standard or Customer defined Reporting
  • Expandable
  • Pass Fail Mode FASTEST UPH MODE
  • Measure, Code Read, Correlate, Data Collect Mode*

                 *UPH Dependant on Wire Count, Measurements, Inspection Criteria etc

 Standard Inspection Capabilities:

  • Missing Die
  • Missing Wire / Misplaced Wire
  • Wire Shorts
  • Wire Breaks
  • Ball Measurement
  • Wire Measurement
  • Wire Sag / Track
  • Die Attach Wetting
  • Epoxy Check. On Die or Lead
  • Chipped or Crack Die
  • Die Scratch
  • Die Orientation
  • Correct Die
  • Theta Check
  • Die Location
  • Correct Wire Bond Location Verification
  • Wire Bond Mapping
  • Multi Die Verification / Missing Component on MCM's
  • Ink Dot
  • Foreign Particles
  • Measurement
  • Serial / Part Numbers / Bar Codes / Device Codes .

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